Package opening device
This is a package opening device suitable for failure analysis. With our unique technology, it has become possible to open packages of Cu wires that were previously difficult to open.
Features ● Forms a coating on "copper" using proprietary technology to protect it from acidic solutions ● Lowers acidic solutions to 10°C for low irritation upon opening ● Compatible with Cu, Al, and Au wires ● Automatically produces mixed acid in 13 different ratios ● Waste liquid is discharged separately for each acidic solution, eliminating concerns about mixing acids with different boiling points
- Company：ハイソル
- Price：Other
